JCET Group

JCET Group stands as a global leader in integrated-circuit manufacturing, providing cutting-edge technology services that power a smarter world. With a comprehensive suite of turnkey solutions, JCET Group excels in semiconductor package integration design, characterization, research and development, wafer probe, wafer bumping, package assembly, final testing, and seamless drop shipment to vendors across the globe.

JCET Group's extensive portfolio supports a diverse range of semiconductor applications, including mobile, communication, compute, consumer, automotive, and industrial sectors. This is achieved through advanced wafer-level packaging, 2.5D/3D integration, System-in-Package (SiP) solutions, and reliable flip chip and wire bonding technologies. Operating from its primary location at 2777 E. Jinxiu Road, Building 29, Shanghai, Shanghai 200000, CN, JCET Group is strategically positioned to serve its worldwide clientele.

With R&D centers in China and Korea, alongside manufacturing facilities in China, Korea, and Singapore, JCET Group ensures close technological collaboration and efficient supply-chain manufacturing for its global customers. The company’s dedication to innovation and quality makes it a trusted partner in the semiconductor industry. We invite the management team at JCET Group to create a customized and exclusive company showcase and product listing on our platform to further amplify their market presence.