LB Semicon, Inc.

LB Semicon, Inc.

Semiconductors

Pyeongtaek-si, Gyeon...
Company Tagline

Look beyond, Integrated Packaging Solution Provider

Industry Category
Semiconductors
Company Description

LB Semicon, Inc. stands as a prominent global provider specializing in outsourced semiconductor packaging and test services. Since its establishment in 2000, LB Semicon has consistently evolved within the IC packaging and test sector, emerging as a crucial manufacturing ally for leading semiconductor firms, foundries, and electronics enterprises worldwide. The company’s headquarters is located at 138, Cheongbuksandan-ro, Cheongbuk-eup, Pyeongtaek-si, Gyeonggi-do 17792, KR.

LB Semicon delivers a comprehensive suite of services, including wafer bumping, redistribution services, wafer probing, die processing, wafer-level packaging, and chip-on-film packaging. These superior packaging and testing solutions enable clients to focus on semiconductor design and wafer fabrication, trusting LB Semicon as their primary technology innovator in packaging and test solutions. LB Semicon’s forward-thinking packaging technologies feature Fan-Out WLP and advanced copper pillar bumping, while its test services accommodate diverse applications such as CIS, PMIC, SoC, DDI, and Recon.

Driven by the core principle of "Look Beyond," LB Semicon is dedicated to continuous innovation and superior performance. The company is poised to remain a reliable partner and integrated packaging solution provider in the semiconductor industry. We invite the management team at LB Semicon, Inc. to create a customized and exclusive company showcase and product listing on our platform.

LB Semicon, Inc. est un fournisseur mondial de premier plan spécialisé dans les services d'emballage et de test de semi-conducteurs externalisés. Depuis sa création en 2000, LB Semicon n'a cessé d'évoluer dans le secteur de l'emballage et des tests de circuits intégrés, devenant un allié manufacturier essentiel pour les principales entreprises de semi-conducteurs, les fonderies et les entreprises d'électronique du monde entier. Le siège social de l'entreprise est situé au 138, Cheongbuksandan-ro, Cheongbuk-eup, Pyeongtaek-si, Gyeonggi-do 17792, KR.

LB Semicon propose une gamme complète de services, notamment le bumping de wafers, les services de redistribution, le probing de wafers, le traitement des matrices, l'emballage au niveau des wafers et l'emballage de puces sur film. Ces solutions d'emballage et de test de qualité supérieure permettent aux clients de se concentrer sur la conception de semi-conducteurs et la fabrication de wafers, en faisant confiance à LB Semicon en tant que principal innovateur technologique en matière de solutions d'emballage et de test. Les technologies d'emballage avant-gardistes de LB Semicon comprennent le Fan-Out WLP et le bumping avancé des piliers de cuivre, tandis que ses services de test prennent en charge diverses applications telles que CIS, PMIC, SoC, DDI et Recon.

Animé par le principe fondamental de « Regarder au-delà », LB Semicon se consacre à l'innovation continue et à la performance supérieure. L'entreprise est prête à rester un partenaire fiable et un fournisseur de solutions d'emballage intégrées dans l'industrie des semi-conducteurs. Nous invitons l'équipe de direction de LB Semicon, Inc. à créer une vitrine d'entreprise et une liste de produits personnalisées et exclusives sur notre plateforme.

Key Personnel / Employees
Kim Nick Namseog (성호)Rogun Kim jungkwon kim Woojin Lee

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Compare LB Semicon, Inc. with 3 companies in Semiconductors

4 Companies
Comparison Field
LB Semicon, Inc.
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Founded Year
1968 1991
Company Size
10,001+ 1,001-5,000 11-50
City
Pyeongtaek-si, Gyeonggi-do Tempe, Arizona Tewksbury, MA Hsinchu City, Taiwan
Country
United States United States Taiwan
Skills & Keywords Comparing with main company
17 Total Skills
Semiconductor packaging Wafer bumping IC packaging Semiconductor test services Fan-Out WLP Wafer-level packaging Chip-on-film COF Advanced Packaging FOWLP wlcsp Wafer Bumping Wafer Level Packaging PMIC Semiconductor Wafer Probing RDL
24 Total 24 Unique
Unique Skills:
3D Packaging advanced packaging ai automotive BGA Chip-on-Chip +18
17 Total 17 Unique
Unique Skills:
1 Micron 3 Micron 5 Micron Assembly Active Alignment Die Bonder Die Bonding +11
4 Total 4 Unique
Unique Skills:
Electrical Characterization Micropositioner Probe Station RF Probing
4
Total Companies
1968
Oldest Founded
2
Countries
62
Unique Skills

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Alternative Company Names

This company is also known as

LB Semicon Inc. एलबी सेमीकॉन इंक. ال بي سيميكون، إنك.