Company Tagline
Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on.
Industry Category
Business Keywords
Company Description
Amkor Technology, Inc. is a leading provider of outsourced semiconductor packaging and test services, delivering innovative solutions since 1968. With a strong commitment to quality and customer satisfaction, Amkor Technology, Inc. has become a trusted partner for semiconductor companies, foundries, and electronics OEMs worldwide.
Headquartered in Tempe, Arizona, at 2045 East Innovation Circle, Amkor Technology, Inc. offers a comprehensive suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. These high-quality services enable clients to concentrate on semiconductor design and wafer fabrication while relying on Amkor Technology, Inc.’s expertise in packaging and testing solutions.
Amkor Technology, Inc.’s global presence includes production facilities, product development centers, and sales and support offices in key electronics manufacturing regions across Asia, Europe, and the USA. With advanced technologies and a customer-centric approach, Amkor Technology, Inc. is well-positioned to meet the evolving needs of the semiconductor industry. Discover how Amkor Technology, Inc. can drive your success. We invite the manager of Amkor Technology, Inc. to create a customized and exclusive company showcase and product listing on our platform.
Amkor Technology, Inc. est l'un des principaux fournisseurs de services d'externalisation d'emballage et de test de semi-conducteurs, offrant des solutions innovantes depuis 1968. Avec un fort engagement envers la qualité et la satisfaction client, Amkor Technology, Inc. est devenu un partenaire de confiance pour les entreprises de semi-conducteurs, les fonderies et les équipementiers électroniques du monde entier.
Basée à Tempe, en Arizona, au 2045 East Innovation Circle, Amkor Technology, Inc. offre une gamme complète de services, comprenant la conception et le développement d'emballages, le test de sondes et d'emballages de plaquettes, les services de bump et de redistribution de plaquettes, l'assemblage et le test final. Ces services de haute qualité permettent aux clients de se concentrer sur la conception de semi-conducteurs et la fabrication de plaquettes tout en s'appuyant sur l'expertise d'Amkor Technology, Inc. en matière de solutions d'emballage et de test.
La présence mondiale d'Amkor Technology, Inc. comprend des installations de production, des centres de développement de produits et des bureaux de vente et de support dans les principales régions de fabrication électronique en Asie, en Europe et aux États-Unis. Grâce à des technologies de pointe et à une approche centrée sur le client, Amkor Technology, Inc. est bien positionnée pour répondre aux besoins en constante évolution de l'industrie des semi-conducteurs. Découvrez comment Amkor Technology, Inc. peut stimuler votre succès. Nous invitons le responsable d'Amkor Technology, Inc. à créer une vitrine d'entreprise et une liste de produits personnalisées et exclusives sur notre plateforme.
Key Personnel / Employees
Compare Companies Side by Side
Compare Amkor Technology, Inc. with 3 companies in Semiconductor-Manufacturing
| Comparison Field |
Amkor Technology, Inc.Main Company |
Integra Technologies...View Profile |
LB Semicon, Inc.View Profile |
UM elettronicaView Profile |
|---|---|---|---|---|
|
Founded Year
|
— | 1983 | 2000 | 1977 |
|
Company Size
|
— | 201-500 | 1,001-5,000 | 11-50 |
|
City
|
Tempe, Arizona | Wichita, Kansas | Pyeongtaek-si, Gyeonggi-do | Adro, Brescia |
|
Country
|
United States | United States | ||
|
Skills & Keywords
Comparing with main company
|
34 Total Skills
Semiconductor Packaging
IC Packaging
Semiconductor Test Services
Wafer Probe
Wafer Bumping
Package Design
Semiconductor Assembly
wlcsp
BGA
IC Design
Power Discretes
TSV
Package-on-Package
ai
Chip-on-Chip
SiP
iot
Laminate
computing
Wafer Test
Wafer Level Packaging
Semiconductors
IC Test
MEMS & Sensors
3D Packaging
Flip Chip
Leadframe
WLFO
Semiconductor
CSP
dsmbga
advanced packaging
automotive
memory
|
15 Total
1 Common
14 Unique
Match
3%
Common Skills:
Wafer Probe
Unique Skills:
Destructive Physical Analysis
Die Prep
Electrical Testing
Engineering Services
Failure Analysis
IC Assembly
+8
|
6 Total
6 Unique
Unique Skills:
Advanced Packaging
COF
FOWLP
PMIC
RDL
Wafer Probing
|
13 Total
13 Unique
Unique Skills:
automazione industriale
controllo processi produttivi
domotica
enologia
green technology
illuminotecnica
+7
|
4
Total Companies1977
Oldest Founded1
Countries67
Unique SkillsSimilar Companies
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Alternative Company Names
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