ASE Global stands as a premier global provider of outsourced semiconductor manufacturing services in assembly and test (OSAT). Addressing the increasing demand for sophisticated electronics across various sectors, ASE Global is strategically integrating its established OSAT and electronic manufacturing services (EMS) business units.
ASE Global delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. The company collaborates closely with customers to understand markets and create value propositions, delivering advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. ASE Global's primary address is No. 26, Chin 3rd Road, Nantze Export Processing Zone, Kaohsiung, Taiwan, TW. Additional locations include 1255 E. Arques Ave, Sunnyvale, CA 94085, US; 550, Chung-Hwa Road, Section 1, Chung-Li, 320, TW; and Waterloo Office Park - Building M, Drève Richelle, 161, Box 23, Waterloo, B-1410, BE.
With strategically located manufacturing facilities within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore, ASE Global serves customers across the global electronics ecosystem. We invite the manager of ASE Global to create a customized and exclusive company showcase and product listing on our platform.
Compare ASE Global with 2 companies in Semiconductor-Manufacturing
| Comparison Field |
ASE GlobalMain Company |
JCET GroupView Profile |
SILICON BOXView Profile |
|---|---|---|---|
|
Founded Year
|
— | 1972 | 2021 |
|
Company Size
|
— | 10,001+ | 1,001-5,000 |
|
City
|
Shanghai, Shanghai | Paya Lebar, Northeast | |
|
Country
|
China | ||
|
Skills & Keywords
Comparing with main company
|
20 Total Skills
Semiconductor Manufacturing
OSAT
EMS
Advanced Packaging
SiP Solutions
Wafer Probe
Embedded Die Technology
Embedded die technology
Wafer probe & bump
Substrate design & supply
System-in-Package
Wafer level packaging
Electronic manufacturing services
TSV-interposer integration
Final test & design
VIPack
Wire bond
Fanout
MEMS & sensor solutions
Fiip chip
|
8 Total
8 Unique
Unique Skills:
2.5D/3D Packaging
eWLB
Flip-Chip
IC Packaging
Wafer Level Packaging
Wire Bond
+2
|
28 Total
1 Common
27 Unique
Match
5%
Common Skills:
OSAT
Unique Skills:
5G
6G
AI
Analog
Artificial Intelligence
Chiplets
+21
|
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