ASE Global

ASE Global

Semiconductor-Manufacturing

Industry Category
Semiconductor-Manufacturing
Company Description

ASE Global stands as a premier global provider of outsourced semiconductor manufacturing services in assembly and test (OSAT). Addressing the increasing demand for sophisticated electronics across various sectors, ASE Global is strategically integrating its established OSAT and electronic manufacturing services (EMS) business units.

ASE Global delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. The company collaborates closely with customers to understand markets and create value propositions, delivering advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. ASE Global's primary address is No. 26, Chin 3rd Road, Nantze Export Processing Zone, Kaohsiung, Taiwan, TW. Additional locations include 1255 E. Arques Ave, Sunnyvale, CA 94085, US; 550, Chung-Hwa Road, Section 1, Chung-Li, 320, TW; and Waterloo Office Park - Building M, Drève Richelle, 161, Box 23, Waterloo, B-1410, BE.

With strategically located manufacturing facilities within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore, ASE Global serves customers across the global electronics ecosystem. We invite the manager of ASE Global to create a customized and exclusive company showcase and product listing on our platform.

Key Personnel / Employees
Elmer Gardiola Bruno Giorgi Armando "Mandy" Pangilinan Steve Rosebaugh Maggie Chen (Test Engineer at DSP Group)

Compare Companies Side by Side

Compare ASE Global with 2 companies in Semiconductor-Manufacturing

3 Companies
Comparison Field
ASE Global
ASE Global
Main Company
JCET Group
JCET Group
View Profile
SILICON BOX
SILICON BOX
View Profile
Founded Year
1972 2021
Company Size
10,001+ 1,001-5,000
City
Shanghai, Shanghai Paya Lebar, Northeast
Country
China
Skills & Keywords Comparing with main company
20 Total Skills
Semiconductor Manufacturing OSAT EMS Advanced Packaging SiP Solutions Wafer Probe Embedded Die Technology Embedded die technology Wafer probe & bump Substrate design & supply System-in-Package Wafer level packaging Electronic manufacturing services TSV-interposer integration Final test & design VIPack Wire bond Fanout MEMS & sensor solutions Fiip chip
8 Total 8 Unique
Unique Skills:
2.5D/3D Packaging eWLB Flip-Chip IC Packaging Wafer Level Packaging Wire Bond +2
28 Total 1 Common 27 Unique
Match 5%
Common Skills:
OSAT
Unique Skills:
5G 6G AI Analog Artificial Intelligence Chiplets +21
3
Total Companies
1972
Oldest Founded
1
Countries
55
Unique Skills

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Alternative Company Names

This company is also known as

ASE Global 环旭电子 एएसई ग्लोबल إيه إس إي جلوبال