Dr. Tresky AG

Dr. Tresky AG

Semiconductor-Manufacturing

Thalwil, Zürich
Switzerland
Company Tagline

Manual and semi-manual Die Bonding solutions for Electronic Manufacturing Services, laboratories and R&D.

Industry Category
Semiconductor-Manufacturing
Company Description

Dr. Tresky AG is a leading provider of manual and semi-manual Die Bonding solutions, serving Electronic Manufacturing Services, laboratories, and R&D facilities. With a legacy spanning four decades, Dr. Tresky AG has honed its expertise in crafting advanced handling and pick & place systems. The company's commitment to innovation and precision engineering makes it a trusted partner for businesses seeking cutting-edge solutions in microelectronics assembly.

Dr. Tresky AG specializes in a comprehensive range of services, including Die Bonding, micro packaging, DFB Laser technology, and lens attachment. Dr. Tresky AG 's versatile solutions cater to diverse applications, such as eutectic Die Bonding, hybrid microcircuits, RF packages, and micro assembly. The company's dedication to quality and customer satisfaction ensures optimal performance and reliability in every project.

Located at Bönirainstrasse 13, Thalwil, Zürich 8800, CH, Dr. Tresky AG is strategically positioned to serve its global clientele. With additional locations at 704 Ginesi Drive, Suite 11A, Morganville, NJ 07751, New Jersey 07751, US; 6935 Aliante Pkwy Ste 104 #532, North Las Vegas, Nevada 89084, US; and 4 Nymboida St, Coogee NSW 2034, South Coogee, New South Wales 2034, AU, the company ensures accessibility and responsiveness to its customers' needs. Dr. Tresky AG continues to drive advancements in the field of microelectronics, empowering businesses to achieve their manufacturing goals.

We invite the manager of Dr. Tresky AG to create a customized and exclusive company showcase and product listing on our platform.

Dr. Tresky AG est un fournisseur leader de solutions de Die Bonding manuelles et semi-manuelles, desservant les services de fabrication électronique, les laboratoires et les installations de R&D. Avec un héritage de quatre décennies, Dr. Tresky AG a perfectionné son expertise dans la création de systèmes de manutention et de placement avancés. L'engagement de l'entreprise envers l'innovation et l'ingénierie de précision en fait un partenaire de confiance pour les entreprises à la recherche de solutions de pointe dans l'assemblage de microélectronique.

Dr. Tresky AG est spécialisée dans une gamme complète de services, comprenant le Die Bonding, le micro-packaging, la technologie laser DFB et la fixation de lentilles. Les solutions polyvalentes de Dr. Tresky AG répondent à diverses applications, telles que le Die Bonding eutectique, les microcircuits hybrides, les boîtiers RF et le micro-assemblage. L'engagement de l'entreprise envers la qualité et la satisfaction de la clientèle garantit des performances et une fiabilité optimales dans chaque projet.

Située à Bönirainstrasse 13, Thalwil, Zürich 8800, CH, Dr. Tresky AG est stratégiquement positionnée pour servir sa clientèle mondiale. Avec des sites supplémentaires au 704 Ginesi Drive, Suite 11A, Morganville, NJ 07751, New Jersey 07751, US ; 6935 Aliante Pkwy Ste 104 #532, North Las Vegas, Nevada 89084, US ; et 4 Nymboida St, Coogee NSW 2034, South Coogee, New South Wales 2034, AU, l'entreprise assure l'accessibilité et la réactivité aux besoins de ses clients. Dr. Tresky AG continue de stimuler les progrès dans le domaine de la microélectronique, permettant aux entreprises d'atteindre leurs objectifs de fabrication.

Nous invitons le responsable de Dr. Tresky AG à créer une vitrine d'entreprise et une liste de produits personnalisées et exclusives sur notre plateforme.

Key Personnel / Employees
Philip Bos Sandro Jakob Andrea Benz Stefan Wueest

Compare Companies Side by Side

Compare Dr. Tresky AG with 1 companies in Semiconductor-Manufacturing

2 Companies
Comparison Field
Dr. Tresky AG
Dr. Tresky AG
Main Company
MRSI SYSTEMS
MRSI SYSTEMS
View Profile
Founded Year
Company Size
1,001-5,000
City
Thalwil, Zürich Tewksbury, MA
Country
Switzerland United States
Skills & Keywords Comparing with main company
29 Total Skills
Die Bonding Microelectronics Assembly Pick and Place Systems Semiconductor Manufacturing Micro packaging Eutectic Die Bonding RF packages PD Micropackaging DFB Laser Lens Attach Hybrid microcircuits Microassembly Epoxy Die Bonding Photo diodes MEMS fine placing MOEMS High Force Bonding Flip Chip Bonding Ultrasonic Die Bonding Solder Paste Die Attach Silver Sintering Die Bonding Thermocompression Die Bonding Die Bonder Microwave modules Solid state lasers VCSEL Chip-on-board
16 Total 1 Common 15 Unique
Match 3%
Common Skills:
Die Bonding
Unique Skills:
1 Micron 3 Micron 5 Micron Assembly Active Alignment Advanced Packaging Epoxy Die Attach +9
2
Total Companies
Oldest Founded
2
Countries
44
Unique Skills

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Alternative Company Names

This company is also known as

Dr. Tresky AG 德. Tresky AG डॉ. ट्रेस्की एजी دكتور تريسكي Д-р Трески АГ