Beckermus Technologies
Appliances-and-Electrical-and-and-Electronics-Manufacturing
Website
Company Tagline
Providing Micro Assembly services: Microelectronics, Electro Optics and Photonics Assembly
Industry Category
Business Keywords
Company Description
Beckermus Technologies specializes in Appliances, Electrical, and Electronics Manufacturing, providing comprehensive Micro Assembly services in Microelectronics, Electro Optics, and Photonics Assembly. With a strong foundation since its establishment in 1998, Beckermus Technologies has consistently delivered high-quality solutions, quick response times, and reasonable pricing to a diverse global clientele, from R&D/NPI to high-volume production.
Located at its primary address at 29 Eshel, Caesarea, IL, Beckermus Technologies operates with a commitment to excellence, supported by certifications including ISO 13485, IPC-A-610, AS9100D aerospace, MILL-STD 883, and QMS. Their services encompass wire bonding, encapsulation, active alignment, IC packaging, 3D stacked dies, electro-optics and photonics assembly, die attach, wafer dicing/sorting, chip on board/chip on flex, flip chip, and wafer-level packaging, along with SiP and MCM.
Beckermus Technologies continues to evolve and expand its capabilities, dedicated to meeting the dynamic needs of the industry. We invite the manager of Beckermus Technologies to create a customized and exclusive company showcase and product listing on our platform, enhancing their market presence and commercial development.
Key Personnel / Employees
Compare Companies Side by Side
Compare Beckermus Technologies with 3 companies in Appliances-and-Electrical-and-and-Electronics-Manufacturing
| Comparison Field |
Beckermus TechnologiesMain Company |
Pishgaman Electronic...View Profile |
ElectronicaView Profile |
Bay PhotonicsView Profile |
|---|---|---|---|---|
|
Founded Year
|
— | 2020 | 2021 | 2007 |
|
Company Size
|
— | 11-50 | 11-50 | 11-50 |
|
City
|
tehran, tehran | Ciriè, italy | Paignton, England | |
|
Country
|
Iran | |||
|
Skills & Keywords
Comparing with main company
|
27 Total Skills
Microelectronics
Electro Optics
Photonics Assembly
Wire Bonding
IC Packaging
Flip Chip
Wafer Level Packaging
Prism assembly
micro assembly
Chip on board
wire bonding
stacked dies assembly
lenses assembly
Wirebonding
MCM
Wafer level packaging
SIP
Photonics assembly
MEMS
Die attach
Chip on flex
Microelectromechanical systems (MEMS) assembling
Micro-optics
Active Alignment
bare die assembly
Diode assembly
Encapsulation
|
15 Total
15 Unique
Unique Skills:
BGA mount
electronic components assembly
IPC standards
LGA mount
pcb assembly
quality control
+9
|
15 Total
15 Unique
Unique Skills:
Circuiti Stampati
Collaudo
die attach
elettronica
firmware
hardware
+9
|
10 Total
10 Unique
Unique Skills:
Co-Packaged Optics
Electronics
Photonic Integrated Circuits
Photonics
Photonics Packaging
PICs
+4
|
4
Total Companies2007
Oldest Founded1
Countries67
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Alternative Company Names
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