We offer open access to our skills and services for Advanced Photonic device assembly and packaging
Bay Photonics is a leading provider of advanced photonic device assembly and packaging solutions, serving the appliances, electrical, and electronics manufacturing industries. Located in Paignton, England at Waddeton Close, Bay Photonics offers open access to its skills and services, enabling clients to achieve their goals from proof of concept to prototyping and full production.
Bay Photonics specializes in Photonic Integrated Circuit (PIC) packaging, leveraging extensive knowledge of semiconductor and laser/LED assembly for design, development, design for manufacture (DFM), production methods, and test (DFT). The company provides both design consultancy and bespoke assembly/packaging services, assisting with New Product Introduction (NPI) engineering as product line volume grows. Bay Photonics also offers support for transferring to manufacturing facilities within the UK or to offshore Contract Electronic Manufacturers and company subsidiaries.
With state-of-the-art facilities, including an ISO class 7 cleanroom, Bay Photonics is well-equipped to meet current and future customer demands. The company's capabilities include manual, semi-auto, and auto die placement, die attach with flip chip capability, and manual and auto gold and aluminum wire bonding. Bay Photonics is also commissioning an hermetic capping/seam sealing capability, ensuring comprehensive service offerings. The team at Bay Photonics looks forward to partnering with you. We invite the manager of Bay Photonics to create a customized and exclusive company showcase and product listing on our platform.
Compare Bay Photonics with 3 companies in Appliances-and-Electrical-and-and-Electronics-Manufacturing
| Comparison Field |
Bay PhotonicsMain Company |
Luceda PhotonicsView Profile |
Irish Photonic Integ...View Profile |
EmberionView Profile |
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Founded Year
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— | 2014 | 2016 | |
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Company Size
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— | 11-50 | 201-500 | 11-50 |
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City
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Paignton, England | |||
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Country
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Skills & Keywords
Comparing with main company
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17 Total Skills
Photonics Packaging
PIC Assembly
Semiconductor Packaging
Optoelectronics
Photonic Integrated Circuits
Die Attach
Wire Bonding
SPADS
Silicon Photonics
Photonics
Photonics assembly
Co-Packaged Optics
PICs
Quantum Components
Electronics
Microelectronics
VCSELs
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4 Total
4 Unique
Unique Skills:
Design automation
Integrated optics
Python
Software
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14 Total
14 Unique
Unique Skills:
Assembly & Packaging
Biomedical
BioPhotonics
Communication
Device Fabrication
III-Nitride
+8
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11 Total
11 Unique
Unique Skills:
Broadbcameras
Graphene
High speed cameras
Imaging
Infrared imaging
Laser
+5
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