Amkor Technology Portugal S.A

Amkor Technology Portugal S.A, a global leader in Appliances, Electrical, and Electronics Manufacturing, has been delivering innovative IC packaging solutions since 1968. With a strong commitment to service and capacity, Amkor Technology Portugal S.A is a trusted partner for global customers.

Located at Av. Primeiro de Maio, 801, Vila do Conde, 4485-629, PT, Amkor Technology Portugal S.A offers a comprehensive suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. These high-quality packaging and test services enable customers to focus on semiconductor design and wafer fabrication, leveraging Amkor's technological innovation.

Amkor Technology Portugal S.A's packaging formats include wafer-level, CSP, BGA, and leadframe, with next-generation 3D packaging solutions. Amkor Technology Portugal S.A continues to introduce state-of-the-art package formats, such as advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). We invite the manager of Amkor Technology Portugal S.A to create a customized and exclusive company showcase and product listing on our platform.