nepes

Nepes is a leading semiconductor manufacturing company, established in 1990. With a strong global presence, Nepes specializes in providing advanced back-end foundry services, including Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (FOPLP), and System in Package (SiP) solutions. Nepes is committed to delivering comprehensive IC back-end services for 8" and 12" wafers, ensuring reliable quality through cutting-edge technology in wafer bumping, IC packaging, and testing.

Operating from its primary address at 서울시 서초구 남부순환로 2415 서울시, 서초구 06719, KR, and with additional locations including 9605 Scranton Rd 샌디에이고, 캘리포니아 92121, US, Nepes has strategically positioned itself to serve a worldwide clientele. Nepes is dedicated to innovation and excellence in the semiconductor industry, continuously enhancing its offerings to meet the evolving needs of Fabless and IDM customers.

Nepes’s commitment to quality and customer satisfaction makes it a trusted partner in the semiconductor industry. The company's global reach and advanced technology solutions ensure it remains at the forefront of semiconductor manufacturing. We invite the management team at Nepes to create a customized and exclusive company showcase and product listing on our platform to further highlight your capabilities.