Nantong Fujitsu Microelectronics Co., Ltd
Semiconductor-Manufacturing
Website
Industry Category
Business Keywords
Company Description
Nantong Fujitsu Microelectronics Co., Ltd (NFME) stands as a premier independent outsourcing semiconductor assembly and test (OSAT) service provider in China. Serving a diverse clientele, including local and overseas customers, IC design houses, and IDMs, Nantong Fujitsu Microelectronics Co., Ltd is committed to delivering excellence in semiconductor solutions.
Founded in 1997 and listed on the Shenzhen Stock Exchange since 2007, Nantong Fujitsu Microelectronics Co., Ltd boasts an extensive portfolio of semiconductor packages. These range from TO, TSSOP, and SOT to QFP, QFN, FBGA, flip chip, and bumping/WLCSP technologies. A leader in innovation, NFME was the first mainland Chinese OSAT to offer full turnkey services for flip chip bumping, wafer sort, assembly, and testing. With mega-operation factories located in Nantong City, Jiangsu Province, Nantong Fujitsu Microelectronics Co., Ltd is well-equipped to meet the evolving demands of the semiconductor industry. The primary address for Nantong Fujitsu Microelectronics Co., Ltd is No.288, Chongchuan Road, Nantong, Jiangsu 226006, CN.
Nantong Fujitsu Microelectronics Co., Ltd maintains its position at the forefront of the industry through continuous advancement and comprehensive service offerings. Their bumping/WLCSP capabilities encompass both 200mm and 300mm wafers, ensuring comprehensive support for clients. We invite the management of Nantong Fujitsu Microelectronics Co., Ltd to create a customized and exclusive company showcase and product listing on our platform, further amplifying their market presence.
南通富士通微电子股份有限公司（NFME）是中国领先的独立外包半导体组装和测试（OSAT）服务提供商。南通富士通微电子股份有限公司致力于为包括本地和海外客户、IC设计公司和IDM在内的多元化客户提供卓越的半导体解决方案。
南通富士通微电子股份有限公司成立于1997年，自2007年起在深圳证券交易所上市，拥有广泛的半导体封装产品组合。这些产品组合包括TO、TSSOP和SOT到QFP、QFN、FBGA、倒装芯片和凸块/WLCSP技术。作为创新领域的领导者，NFME是中国大陆第一家为倒装芯片凸块、晶圆分选、组装和测试提供全套总包服务的OSAT。南通富士通微电子股份有限公司在江苏省南通市设有大型运营工厂，完全有能力满足半导体行业不断变化的需求。南通富士通微电子股份有限公司的主要地址是中国江苏省南通市崇川路288号，邮编226006。
南通富士通微电子股份有限公司通过持续进步和全面的服务产品，保持其在行业前沿的地位。他们的凸块/WLCSP能力包括200mm和300mm晶圆，确保为客户提供全面的支持。我们诚挚邀请南通富士通微电子股份有限公司的管理层在我们的平台上创建一个定制和独家的公司展示和产品列表，进一步扩大其市场影响力。
Key Personnel / Employees
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Compare Nantong Fujitsu Microelectronics Co., Ltd with 3 companies in Semiconductor-Manufacturing
| Comparison Field |
Nantong Fujitsu Microelec...Main Company |
Stars Microelectroni...View Profile |
E.K.S.S. Microelectr...View Profile |
SwissSEM Technologie...View Profile |
|---|---|---|---|---|
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Founded Year
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— | 1995 | 2002 | 2019 |
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Company Size
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— | 1,001-5,000 | 2-10 | 51-200 |
|
City
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Nantong, Jiangsu | Klongjig Bang Pa-in District, Ayutthaya | Lenzburg, Aargau | |
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Country
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China | Thailand | Switzerland | |
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Skills & Keywords
Comparing with main company
|
17 Total Skills
Semiconductor Assembly
Semiconductor Test
OSAT Services
IC Packaging
Flip Chip
Wafer Bumping
WLCSP
FBGA
300mm Wafer Bumping/WLCSP
QFP
Design
System-in-Package (SiP)
200mm Wafer Bumping/WLCSP
TO
Semiconductors
TSOP
QFN
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21 Total
21 Unique
Unique Skills:
Advanced IC Packaging
Battery Management System
Box build
Clean Room
COB Assembly
Electronic Manufacturing Services
+15
|
40 Total
40 Unique
Unique Skills:
Air Cavity
Analog - Mixed Signal
asic
Assembly
Back Grinding
Ball Bonding
+34
|
10 Total
10 Unique
Unique Skills:
Assembly
Double pulse testing
Electronics
IGBT
Power
Project
+4
|
4
Total Companies1995
Oldest Founded3
Countries86
Unique SkillsSimilar Companies
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Alternative Company Names
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