Intech Technologies International (S) Pte Ltd
Semiconductor-Manufacturing
Website
Industry Category
Business Keywords
Company Description
Intech Technologies International (S) Pte Ltd stands at the forefront of semiconductor manufacturing, offering a comprehensive suite of prototyping services designed to accelerate innovation and ensure precision. Located at #07-07, 20 Woodlands Link, Singapore, 738733, SG, Intech Technologies International (S) Pte Ltd is dedicated to providing high-quality solutions that meet the evolving needs of the semiconductor industry.
Specializing in wafer dicing, wafer sort, and wafer back grinding, Intech Technologies International (S) Pte Ltd delivers exceptional assembly services including wire bonding, die bonding, and flip chip bonding. Their expertise extends to package services such as package molding encapsulation, low profile quad flat package, and quad flat no lead package. These services are complemented by robust failure analysis capabilities, incorporating SEM/X-ray, die shear, and wire pull testing to guarantee reliability and performance.
Intech Technologies International (S) Pte Ltd is committed to building lasting partnerships with its clients, providing unparalleled support and guidance throughout every stage of the prototyping process. The company’s dedication to staying ahead of industry advancements ensures that clients benefit from state-of-the-art equipment and techniques. We invite the manager of Intech Technologies International (S) Pte Ltd to create a customized and exclusive company showcase and product listing on our platform, further enhancing their market presence and commercial development.
Intech Technologies International (S) Pte Ltd berada di barisan hadapan pembuatan semikonduktor, menawarkan suite perkhidmatan prototaip yang komprehensif yang direka untuk mempercepat inovasi dan memastikan ketepatan. Terletak di #07-07, 20 Woodlands Link, Singapura, 738733, SG, Intech Technologies International (S) Pte Ltd berdedikasi untuk menyediakan penyelesaian berkualiti tinggi yang memenuhi keperluan industri semikonduktor yang berkembang.
Mengkhusus dalam pemotongan wafer, penyisihan wafer dan pengisaran belakang wafer, Intech Technologies International (S) Pte Ltd menyampaikan perkhidmatan pemasangan yang luar biasa termasuk ikatan wayar, ikatan die dan ikatan cip flip. Kepakaran mereka meliputi perkhidmatan pakej seperti enkapsulasi pengacuan pakej, pakej rata quad profil rendah dan pakej quad rata tanpa plumbum. Perkhidmatan ini dilengkapi dengan keupayaan analisis kegagalan yang teguh, menggabungkan SEM/X-ray, ricih die dan ujian tarik wayar untuk menjamin kebolehpercayaan dan prestasi.
Intech Technologies International (S) Pte Ltd komited untuk membina perkongsian yang berkekalan dengan pelanggannya, menyediakan sokongan dan bimbingan yang tiada tandingan sepanjang setiap peringkat proses prototaip. Dedikasi syarikat untuk terus mendahului kemajuan industri memastikan pelanggan mendapat manfaat daripada peralatan dan teknik terkini. Kami menjemput pengurus Intech Technologies International (S) Pte Ltd untuk mencipta pameran syarikat dan penyenaraian produk tersuai dan eksklusif di platform kami, seterusnya meningkatkan kehadiran pasaran dan pembangunan komersial mereka.
Key Personnel / Employees
Compare Companies Side by Side
Compare Intech Technologies International (S) Pte Ltd with 3 companies in Semiconductor-Manufacturing
| Comparison Field |
Intech Technologies Inter...Main Company |
MicrosemblyView Profile |
ProSMT ElektronikView Profile |
Secol Power LEDView Profile |
|---|---|---|---|---|
|
Founded Year
|
— | 2019 | 2016 | 2009 |
|
Company Size
|
— | 11-50 | 11-50 | 11-50 |
|
City
|
Merrimack, New Hampshire | Istanbul, Tuzla | Nilüfer, Bursa | |
|
Country
|
United States | Turkey | ||
|
Skills & Keywords
Comparing with main company
|
21 Total Skills
Semiconductor Prototyping
Wafer Dicing
Wire Bonding
Die Bonding
Failure Analysis
Package Molding
Flip Chip Bonding
Semiconductor Prototyping Services
Wafer Sort
Wafer Back-Grinding
Assembly Services
Package Services
Filp Chip Bonding
Encapsulation
Low Profile Quad Flat Package
No Lead Package
Micro Semiconductor Failure Analysis
X-Ray Analysis
SEM
SAM
Die Shear / Wire Pull
|
8 Total
8 Unique
Unique Skills:
Amplifiers
Chip & Wire
Design for Manufacturing
Eutectic & Epoxy Die Attach
Microelectronic Assembly
PCB Assembly
+2
|
45 Total
45 Unique
Unique Skills:
After Sales Support
Akustik Mikroskop
AOI
AXI
Axial THT Inserter
Buhar Fazı Lehimleme
+39
|
6 Total
6 Unique
Unique Skills:
Aydınlatma
LED
LED Packacing
PCB Tasarımı
SMD Dizgi
Yarı İletkenler
|
4
Total Companies2009
Oldest Founded2
Countries78
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Alternative Company Names
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