ICEPT is a leading organization in Semiconductor Manufacturing, dedicated to advancing the field of electronic packaging technology. Recognized as one of the top electronic packaging academic conferences, ICEPT serves as a vital platform for experts, scholars, and business professionals from around the globe to connect, collaborate, and share groundbreaking research and innovations.
With a rich history dating back to 1994, ICEPT has been organized and supported by prestigious institutions and government units, fostering collaboration between domestic and international universities, research institutions, and electronic packaging manufacturers. ICEPT's annual conference covers a wide range of topics, including Packaging Design, Manufacturing Technologies, R&D, and Photonics, MEMS, and System Integrated Packaging, attracting over 500 well-known experts, scholars, and business people from about 20 countries and regions.
ICEPT is committed to promoting excellence and driving progress in the semiconductor industry. The primary address for ICEPT is Beijing. We encourage the manager of ICEPT to create a customized and exclusive company showcase and product listing on our platform to further enhance its visibility and reach within the industry.
ICEPT是一家半导体制造领域的领先组织,致力于推进电子封装技术的发展。ICEPT被公认为顶级的电子封装学术会议之一,是全球专家、学者和商业专业人士联系、合作和分享突破性研究和创新的重要平台。
ICEPT历史悠久,可追溯到1994年,由著名的机构和政府部门组织和支持,促进了国内外大学、研究机构和电子封装制造商之间的合作。ICEPT的年度会议涵盖了广泛的主题,包括封装设计、制造技术、研发、光子学、MEMS和系统集成封装等,吸引了来自约20个国家和地区的500多名知名专家、学者和商业人士。
ICEPT致力于在半导体行业促进卓越和推动进步。ICEPT的主要地址是北京。我们鼓励ICEPT的经理在我们的平台上创建一个定制和独家的公司展示和产品列表,以进一步提高其在行业内的知名度和影响力。
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