EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors and more.
EV Group (EVG) stands as a prominent provider of cutting-edge equipment and process solutions tailored for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Since its founding in 1980, EV Group has been dedicated to serving a global network of customers and partners, offering comprehensive services and support. EV Group's commitment to innovation and quality has established it as a trusted name in the industry.
EV Group's key product offerings include advanced solutions for wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL), and metrology equipment. Additionally, EV Group provides state-of-the-art photoresist coaters, cleaners, and inspection systems, ensuring comprehensive support for semiconductor manufacturing needs. The primary address for EV Group is DI Erich Thallner Str. 1, St. Florian am Inn, 4782, AT.
EV Group continues to drive advancements in semiconductor technology, contributing significantly to the progress of various industries worldwide. To learn more about how EV Group can enhance your manufacturing processes, please visit www.EVGroup.com. We invite the manager of EV Group to create a customized and exclusive company showcase and product listing on our platform to further highlight their exceptional offerings.
Compare EV Group with 3 companies in Semiconductor-Manufacturing
| Comparison Field |
EV GroupMain Company |
AMO GmbHView Profile |
Brewer ScienceView Profile |
StensborgView Profile |
|---|---|---|---|---|
|
Founded Year
|
— | 1993 | 1981 | 1998 |
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Company Size
|
— | 51-200 | 201-500 | 11-50 |
|
City
|
Rolla, Missouri | Roskilde, Sjælland | ||
|
Country
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Denmark | |||
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Skills & Keywords
Comparing with main company
|
15 Total Skills
Semiconductor Manufacturing
Wafer Bonding
MEMS
Lithography
Nanoimprint Lithography
Metrology Equipment
Thin-Wafer Processing
Advanced Packaging
Compound Semiconductors
Bonding
Nanotechnology
Temporary Bonding / Debonding
3DIC
SOI
Process Technology
|
7 Total
7 Unique
Unique Skills:
2D Materials
Advanced Nanolithography
Nanofabrication
Nanophotonics
NEMS
Research & Service Provider
+1
|
9 Total
9 Unique
Unique Skills:
Advanced Packaging & 2.5/3D IC
Carbon Electronics
Emerging Technologies
LED & Energy Devices
Printed Electronics
Process & Simulation Systems
+3
|
17 Total
17 Unique
Unique Skills:
Advanced 3D Structures For Microfluidics
Desktop R2P NanoImprinter
Diffractive optical elements
Flexible solar cells production
Hologram imprinting
Holographic optical elements
+11
|
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