Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology is a solution-driven company dedicated to serving the semiconductor assembly industries worldwide. With a strong focus on quality, Boschman Advanced Packaging Technology provides specialized solutions for market segments including MEMS & Sensors, Smartcards, and Power modules.

Founded in 1987, Boschman Advanced Packaging Technology has its headquarters in a modern, well-equipped facility in Duiven, Netherlands, located at Stenograaf 3, 6921EX, NL. The company excels in developing molding and Ag-Sinter systems at its R&D facility in the Netherlands, where multidisciplinary teams of experts in mechanical, electrical, software, process, and mold/tool-design collaborate to deliver optimal system solutions. Systems are produced, assembled, and tested at the facility in Singapore, ensuring the highest possible production quality with the support of local engineers.

Boschman Advanced Packaging Technology is committed to excellence and sustainability, carefully selecting materials and parts based on functionality, safety, availability, and environmental impact. Discover how Boschman Advanced Packaging Technology can enhance your semiconductor assembly needs. We invite the management team to create a customized and exclusive company showcase and product listing on our platform to further highlight their innovative solutions.