Applied Microengineering (AML)

Applied Microengineering (AML) is a distinguished manufacturer specializing in advanced wafer bonding equipment, setting industry standards with its innovative solutions. Applied Microengineering (AML) designs and manufactures integrated Wafer Bonding systems, featuring a unique capability for in-situ alignment of wafers immediately before bonding. These aligner-bonder systems are meticulously configured to meet specific customer requirements, with Applied Microengineering (AML) offering design modifications and expert guidance on process development.

Serving a global clientele, Applied Microengineering (AML)’s systems are utilized by leading universities, research institutes, and commercial device producers, handling wafers up to 8 inches. Established in 1992, Applied Microengineering Ltd (AML) is located on Harwell Campus, Unit 8 Library Avenue, Didcot, OX11 0SG, GB, the UK’s premier science and innovation hub, adjacent to the Rutherford Appleton Laboratory (RAL). This strategic location grants Applied Microengineering (AML) access to RAL’s state-of-the-art cleanrooms and services, complementing its own in-house facilities.

Applied Microengineering (AML) remains at the forefront of semiconductor manufacturing, consistently delivering high-quality wafer bonding solutions. The company’s commitment to innovation and customer satisfaction ensures its continued success and growth in the global market. We invite the manager of Applied Microengineering (AML) to create a customized and exclusive company showcase and product listing on our platform to further enhance their market presence.