Customized Swiss Microelectronics – Modules / ASICs / Thick Film Substrates f. Medical Devices & Industrial Applications
Microdul AG stands as a premier provider of customized Swiss microelectronics, specializing in modules, ASICs, and thick film substrates tailored for medical devices and industrial applications. With decades of expertise, Microdul AG has established itself as a trusted partner, offering comprehensive solutions from development and engineering to the production and testing of custom applications. The company's commitment to innovation and precision positions it as a leader in the microelectronics sector.
Located at Grubenstrasse 9, Zürich, 8045, CH, Microdul AG is dedicated to delivering high-quality, miniaturized solutions. The company's broad and in-depth know-how in medical device (AIMD) and industrial electronics ensures that clients receive state-of-the-art products designed to meet the most demanding requirements. Microdul AG continues to drive advancements in microelectronics, supporting the growth and success of its partners.
Microdul AG is poised for continued growth and innovation in the microelectronics industry. We invite the management of Microdul AG to create a customized and exclusive company showcase and product listing on our platform to further enhance its market presence.
Compare Microdul AG with 3 companies in Computers-and-Electronics-Manufacturing
| Comparison Field |
Microdul AGMain Company |
Fang ConsultingView Profile |
Hardware Pioneers Ma...View Profile |
SILICON BOXView Profile |
|---|---|---|---|---|
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Founded Year
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— | 1999 | 2015 | 2021 |
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Company Size
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— | 11-50 | 11-50 | 1,001-5,000 |
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City
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Roseville, MN | Paya Lebar, Northeast | ||
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Country
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United States | |||
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Skills & Keywords
Comparing with main company
|
56 Total Skills
Microelectronics
ASIC Design
Thick Film Substrates
Medical Devices
Industrial Electronics
Miniaturization
Module Production
II
ASIC Services
Miniaturized Modules
Customized Electronics
Mixed-Signal ASICs
Ultra-Low-Power Sensors
ASICdesign
Microelectronics Production for Medical
Substrates for Harsh Conditions
Packaging
ASIC
Multilayer Thick Film Substrates
Dynamic Touch Sensors
Class 3 AIMDs
Multiple Resistance Printing
Implantable Devices
ISO13485
Electronic Implants
Contract Manufacturer
Class I
III medical devices
Microsystem Technologies
Temperature Sensing
Capacitive Sensors
Wirebonding
FlipChip
Medical Microelectronics
AIMD electronics
Capacitive Switches
Medical Device Electronics
Class 3 Implants
Medical Electronics
Semiconductors
Glob Top
Wafer Testing
Neurostimulation ASIC
SMD Assembly
Ceramic Circuit Boards
Fine-Line Screen Printing
Via Technology
Laser-Trimmed Resistors
Circuit Boards
Module Assembly
Electronic Temperature Monitoring
Active Implantable Medical Devices
Ultra-low Power
Micromodules for Medical Implants
Chip Stacking
Ultra-Low Power Modules
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17 Total
17 Unique
Unique Skills:
21 CFR
510(k)
CE Mark
Design Dossier Preparation
FDA
HIPAA Compliant
+11
|
17 Total
1 Common
16 Unique
Match
2%
Common Skills:
Microelectronics
Unique Skills:
Computer Hardware
Connected Hardware
Electronic components
Electronic Design Engineering
Electronic Engineering
Electronic Hardware
+10
|
28 Total
28 Unique
Unique Skills:
5G
6G
Advanced Packaging
AI
Analog
Artificial Intelligence
+22
|
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